EU ELV 납 예외조항 개정 (‘23.6.1)

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EU ELV 납 예외조항 개정 (‘23.6.1)
2023-06-21

시행일: 2023년 6월 1일

유럽연합(EU; European Union)의 폐차처리지침(ELV; End-of-Life Vehicles)이 개정되어 6월부터 적용될 예정입니다.

배터리 내 납 사용에 대한 예외조항 5(b)를 5(b)(i)와 5(b)(ii)로 세분화하였습니다.

또한, 일부 항목의 만료일 혹은 재검토일이 변경되었습니다.

자세한 사항은 아래 표1을 참고하시기 바랍니다.

표1. 변경 내용

변경전

변경후

Materials and components

Scope and expiry date of the exemption

Materials and components

Scope and expiry date of the exemption

Lead as an alloying element

2(c)(i). Aluminium alloys for machining purposes with a lead content up to 0.4 % by weight

This exemption shall be reviewed in 2021.

내용 동일

Vehicles type-approved before 1 January 2028 and spare parts for these vehicles

2(c)(ii). Aluminium alloys not included in entry 2(c)(i) with a lead content up to 0.4 % by weight

This exemption shall be reviewed in 2021.

내용 동일

This exemption shall be reviewed in 2024.

3. Copper alloys containing up to 4 % lead by weight

This exemption shall be reviewed in 2021.

내용 동일

This exemption shall be reviewed in 2025.

Lead and lead compounds in components

5(b). Lead in batteries for battery applications not included in entry 5(a)*

*5(a). Lead in batteries used in high-voltage systems that are used only for propulsion in M1 and N1 vehicles

This exemption shall be reviewed in 2021.

5(b)(i). Lead in batteries:

(1) used in 12 V applications

(2) used in 24 V applications in special purpose vehicles as defined in Article 3 of Regulation (EU) 2018/858of the European Parliament and of the Council

This exemption shall be reviewed in 2025.

5(b)(ii). Lead in batteries used in applications not included in entry 5(a) or entry 5(b)(i)

Vehicles type approved before 1 January 2024 and spare parts for these vehicles

8(e). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)

This exemption shall be reviewed in 2021.

내용 동일

This exemption shall be reviewed in 2024.

8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:

(1) a semiconductor technology node of 90 nm or larger;

(2) a single die of 300 mm 2 or larger in any semiconductor technology node;

(3) stacked die packages with dies of 300 mm 2 or larger, or silicon interposers of 300mm 2 or larger.

Valid for vehicles type-approved from 1 October 2022 and spare parts for these vehicles

내용 동일

This exemption shall be reviewed in 2024.

Vehicles type-approved from 1 October 2022 and spare parts for these vehicles

 
 
 

참고(원문):

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