시행일: 2023년 6월 1일
유럽연합(EU; European Union)의 폐차처리지침(ELV; End-of-Life Vehicles)이 개정되어 6월부터 적용될 예정입니다.
배터리 내 납 사용에 대한 예외조항 5(b)를 5(b)(i)와 5(b)(ii)로 세분화하였습니다.
또한, 일부 항목의 만료일 혹은 재검토일이 변경되었습니다.
자세한 사항은 아래 표1을 참고하시기 바랍니다.
표1. 변경 내용
변경전 |
변경후 |
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Materials and components |
Scope and expiry date of the exemption |
Materials and components |
Scope and expiry date of the exemption |
Lead as an alloying element |
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2(c)(i). Aluminium alloys for machining purposes with a lead content up to 0.4 % by weight |
This exemption shall be reviewed in 2021. |
내용 동일 |
Vehicles type-approved before 1 January 2028 and spare parts for these vehicles |
2(c)(ii). Aluminium alloys not included in entry 2(c)(i) with a lead content up to 0.4 % by weight |
This exemption shall be reviewed in 2021. |
내용 동일 |
This exemption shall be reviewed in 2024. |
3. Copper alloys containing up to 4 % lead by weight |
This exemption shall be reviewed in 2021. |
내용 동일 |
This exemption shall be reviewed in 2025. |
Lead and lead compounds in components |
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5(b). Lead in batteries for battery applications not included in entry 5(a)* *5(a). Lead in batteries used in high-voltage systems that are used only for propulsion in M1 and N1 vehicles |
This exemption shall be reviewed in 2021. |
5(b)(i). Lead in batteries: (1) used in 12 V applications (2) used in 24 V applications in special purpose vehicles as defined in Article 3 of Regulation (EU) 2018/858of the European Parliament and of the Council |
This exemption shall be reviewed in 2025. |
5(b)(ii). Lead in batteries used in applications not included in entry 5(a) or entry 5(b)(i) |
Vehicles type approved before 1 January 2024 and spare parts for these vehicles |
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8(e). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) |
This exemption shall be reviewed in 2021. |
내용 동일 |
This exemption shall be reviewed in 2024. |
8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following: (1) a semiconductor technology node of 90 nm or larger; (2) a single die of 300 mm 2 or larger in any semiconductor technology node; (3) stacked die packages with dies of 300 mm 2 or larger, or silicon interposers of 300mm 2 or larger. |
Valid for vehicles type-approved from 1 October 2022 and spare parts for these vehicles |
내용 동일 |
This exemption shall be reviewed in 2024. Vehicles type-approved from 1 October 2022 and spare parts for these vehicles |
참고(원문): EUR-Lex – 32023L0544 – EN – EUR-Lex
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