1. 변경예정일 : 2020-06-17
2. 변경 내용 요약
1) 납 사용목적 코드 8(g)를 납땜 위치 특성에 따라 4가지로 세분화 2) 납 사용목적 코드 8(k) 신규 생성 3) 6가크롬 사용목적코드 14를 가동시 평균 전력치에 따라 3가지로 세분화
3. 상세 변경사항
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구분 |
ELV Annex 2의 사용목적 코드 |
현재 |
변경 후 (20.6.17) |
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Lead and its compounds used as/in |
8(g)(i). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages |
8(g) – Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages |
8(g)(i). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages |
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8(g)(ii-i) – Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of a semiconductor technology node of 90 nm or larger |
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8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following: (i) a semiconductor technology node of 90 nm or larger; (ii) a single die of 300 mm₂ or larger in any semiconductor technology node; (iii) stacked die packages with dies of 300 mm₂ or larger, or silicon interposers of 300 mm₂ or larger. |
8(g)(ii-ii) – Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of a single die of 300 mm₂ or larger in any semiconductor technology node |
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8(g)(ii-iii) – Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of stacked die packages with dies of 300 mm² or larger, or silicon interposers of 300 mm² or larger |
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Lead and its compounds used as/in |
8(k). Soldering of heating applications with 0,5A or more of heat current per related solder joint to single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not cover soldering to contacts embedded in the intermediate polymer 단일 접합 유리(두께 2.1 mm이하)에 접합 부위당 0.5A 이상의 열 전류를 갖는 납땜. 이 예외는 중간 중합체 내 접합을 위한 납땜은 포함하지 않음. |
8(k) – Soldering of heating applications with 0,5A or more of heat current per related solder joint to single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not cover soldering to contacts embedded in the intermediate polymer 단일 접합 유리(두께 2.1 mm이하)에 접합 부위당 0.5A 이상의 열 전류를 갖는 납땜. 이 예외는 중간 중합체 내 접합을 위한 납땜은 포함하지 않음. |
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Hexavalent chromium and its compounds used as/in |
14. Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution: 흡수식 냉각기 내 탄소강 냉각시스템의 부식방지제(냉각 용액 내 최대 0.75w%) (i) designed to operate fully or partly with electrical heater, having an average utilised electrical power input <75W at constant running conditions; (ii) designed to operate fully or partly with electrical heater, having an average utilised electrical power input ≥ 75W at constant running conditions; (iii) designed to fully operate with nonelectrical heater. |
14 – Absorption refrigerators in motorcaravans
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14(i) – Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution designed to operate fully or partly with electrical heater, having an average utilised electrical power input <75W at constant running conditions |
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14(ii) – Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution designed to operate fully or partly with electrical heater, having an average utilised electrical power input ≥75W at constant running conditions |
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14(iii) – Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution designed to fully operate with nonelectrical heater |